Intel’s EyeQ 5 vs. Nvidia’s Xavier: Wrong Debate

Release time:2017-12-07
author:Ameya360
source:Junko Yoshida
reading:1862

  Does comparing Intel’s EyeQ 5 with Nvidia’s Xavier make sense? That is the question.

  Nvidia and Intel are engaged in a specsmanship battle over AI chips for autonomous vehicles that reached a new high — or more accurately a new low — when Intel CEO Brian Krzanich recently spoke at an auto show in Los Angeles. Krzanich claimed that EyeQ 5 — designed by Intel subsidiary Mobileye — “can deliver more than twice the deep-learning performance efficiency" than Nvidia’s Xavier SoC.

  After the Intel CEO’s keynote, Danny Shapiro, Nvidia's senior director of automotive, called EE Times from L.A. and cried foul.

  First, Shapiro explained that comparing the two chips with two different rollout dates on two different process nodes (Xavier on 16nm vs. EyeQ5 on 7nm) isn’t kosher.

  According to Shapiro, Xavier, which is “already in bring up now,” will be in volume production in 2019. Intel, in contrast, said that EyeQ 5 is “sampling in 2018, production/volume in 2020, and first customer car in 2021 (BMW iNext).”

  Second, Shapiro pointed out that Nvidia’s Drive PX Xavier’s 30 watts of power consumption at 30 trillion operations per second (TOPS), quoted by Intel, is “for the entire system, CPU, GPU and memory, as opposed to just deep learning cores as in the EyeQ 5.”

  Out of line

  So, was it out of line for Intel to compare EyeQ5 to Xavier?

  “Of course it was,” said Jim McGregor, founder and principal analyst at Tirias Research. But he sees an even a bigger issue in that “nobody is comparing a platform to a platform today,” in autonomous vehicle solutions.

  Indeed, just comparing the specs of the two SoCs alone seems almost silly without discussing what other chips — in addition to the said SoCs — are needed to complete a Level 4 or Level 5 autonomous vehicle platform.

  In our recent interview with Intel, the CPU giant revealed plans to unveil soon “a multi-chip platform for autonomous driving,” which will combine the EyeQ 5 SoC, Intel’s low-power Atom SoCs, and other hardware including I/O and Ethernet connectivity. But the company offered no details on TOPS or watts on the entire platform available yet.

  Simply put, Xavier has a far more powerful AI engine than EyeQ5.

  Mike Demler, senior analyst at the Linley Group, agreed. “Forget the process-node nonsense. To achieve Level 4/5, it starts with the TOPS of the neural-network engine and the compute performance of the CPUs,” he said. “Then you look at the power, because if you don’t have the performance, it really doesn’t matter.”

  If so, why are the two giants fighting tooth and nail to one-up on each other with their SoC specs? The answer is that, while they are still in an early phase of the autonomous vehicle technology battle, neither company wants it said that their solution consumes too much power or is less capable than their rival.

  This escalating specsmanship, however, speaks volume about Intel’s commitment to muscle back into the automotive chip market, noted McGregor.

  McGregor reminded us that Intel was once the dominant supplier of microcontrollers to Ford Motors. Intel’s 8061 microcontrollers and its derivatives were reportedly used in almost all Ford automobiles built from 1983 to 1994. When Ford transitioned from Intel microcontrollers to Motorola, Intel lost presence in the automotive market. By 2005, Intel announced it would discontinue production of all its automotive microcontroller chips.

  Now, Intel is counting on its $15 billion Mobileye acquisition to redeem itself in the automotive world.

  L4/L5 cars need how much TOPS?

  Nvidia insisted that a genuine apples-to-apples comparison on the power efficiency of the two chips can be only made when Xavier and EyeQ5 are compared at 24 TOPS, assuming that both were designed on a 7nm process node.

  Based on these parameters (24TOPS at 7nm), Shapiro calculated, “With our current Xavier product, 24TOPS would consume approximately 12W of power for just the DLA (deep learning acceleration) +GPU.” He added, “If we move from the current 16nm to 7nm, we expect power to be reduced by approximately 40 percent, so that would put Xavier at about 7W.”

  The Nvidia executive concluded, “Hence the accurate chart would be: at 24 TOPs performance, EyeQ 5 is at 10W and Nvidia Xavier is at 7W.”

  Demler doesn’t buy such an argument.

  The debate, he said, isn’t about an SoC-to-SoC spec comparison, but the actual performance necessary for L4/L5 autonomous cars. On one hand, “Intel/Mobileye claim their 24 TOPs is sufficient,” said Demler. On the other hand, Nvidia is “building Pegasus [platform] to max out at 320 TOPS.” At issue are, said Demler: “Who has more L4/L5 engagements? How much performance will we need?” Demler said, “Nobody knows, even if Mobileye thinks they do.”

  Moving targets

  When Nvidia originally announced the Xavier chip, the company quoted 20TOPS at 20W. But now, Nvidia is saying it’s 30TOPS at 30W. What happened?

  While acknowledging its originally announced spec, Shapiro explained, “if we cranked the clocks we can scale to 30TOPS at 30W.”

  Similarly, Intel today seems to quote an EyeQ 5 SoC spec very different from what was originally announced by Mobileye, before it was acquired by Intel.

  EyeQ 5, according to Mobileye’s initial announcement, would have processing power of 12 Tera operations per second at power consumption below 5W. But last week when EE Times talked to Jack Weast, Intel's principal engineer and chief architect of autonomous driving solutions, he described EyeQ 5 delivering 24TOPS at 10W.

  Asked when and how the SoC’s performance suddenly doubled, an Intel spokeswoman told us that Intel is now planning to deliver multiple EyeQ 5’s, “including the 12TOPs SKU announced previously and the 24TOPS SKU we compared to the Nvidia Xavier product.”

  Pressed to explain if this means there are two cores integrated inside EyeQ5 24TOPS, or that Intel is using two chips inside a system, the Intel spokeswoman declined to elaborate. She said, “I can’t comment on how we came up with that level of TOPS yet. We’ll have more details on architecture and platform going into CES.”

  Meanwhile, Demler was told by Mobileye that “to support Level 4/5, they will use two EyeQ 5s.”

  The analyst community is in agreement that the target of Mobileye-designed EyeQ 5 performance is too low compared to Nvidia’s Xavier. Demler described the two EyeQ5’s as “just the ‘eyes’ of the system.” In Intel’s upcoming platform, the brains will come from Atom SoCs.

  “EyeQ has relatively weak old MIPS CPUs compared to Nvidia’s custom ARMv8 CPUs (eight of them in Xavier),” noted Demler. “Those custom ARM cores deliver very powerful ‘brains,’ so you don’t need an Atom or Xeon. Therefore, Intel shouldn’t deny that its ‘PC’ processors come into play.”

  In short, Demler agreed with Nvidia’s Shapiro, saying that Nvidia’s Xavier offers DLA and GPU, while EyeQ5 provides “specialized computer-vision cores.”

  So, if Xavier vs. EyeQ5 is an apples-to-oranges comparison, as many industry observers pointed out, what should be used for more accurate comparison?

  Demler took a shot by suggesting to “match up Drive PX with the equivalent of Intel’s Go system.” Intel’s Go system is a development platform for autonomous driving.

  “Remove the FPGAs Intel originally described and drop in EyeQ processors. That’s what they’re building for BMW,” Demler surmised. “So let’s say a minimum performance dual-EyeQ5 + Atom = ~50 watts (just a rough estimate) with 40 TOPs of neural network performance, compared to dual Xavier at 60TOPS/60Watts. That’s a more apples/apples comparison. You can’t leave the Intel brain chip out of the equation.”

  Power efficiency

  Phil Magney, founder and principal advisor for Vision Systems Intelligence (VSI), told EE Times that both Intel and Nvidia “are making a bigger deal out of this than may be necessary.”

  While all this specsmanship was originally about the power efficiency of the rival SoCs, Magney said, “I would expect most L4/L5 vehicles are going to have electric powertrains so the wattage may be a moot point.”

  He observed that when Tesla switched from Mobileye to Nvidia with autopilot, “we saw no noticeable degradation in range. So electric powertrains will handle this without much impact.”

  In Magney's opinion, “The same could be said for 48-volt architectures and mild hybrids since they have the capacity to handle greater loads. On the other hand, a traditional ICE would take a hit but this hit would be at the expense of fuel efficiency and emissions.”

  Nvidia’s Shapiro disagreed. He acknowledged that power consumption does matter. “If a robotic car is expected to drive for nine hours per day, you want to be as energy efficient as possible, because it will eventually affect the EV’s range."

  Noting that fully automated vehicles “will have redundancies in most of the systems including the AV systems,” Magney estimated, “Couple two of everything and that adds to massive loads on the electrical systems.” However, he remains more optimistic. “Battery technologies and battery management are improving and so too are ranges so this problem gets solved in time.”

("Note: The information presented in this article is gathered from the internet and is provided as a reference for educational purposes. It does not signify the endorsement or standpoint of our website. If you find any content that violates copyright or intellectual property rights, please inform us for prompt removal.")

Online messageinquiry

reading
Intel 18A Yields Up 7%–8% Monthly as 2H26 Customers Expected; Said to Push 18A CPUs Amid Shortages
  Intel’s turnaround appears to be gaining momentum. According to CNBC, Intel CEO Lip-Bu Tan said the company’s foundry business is making progress, with 18A process yields now improving by 7% to 8% per month, signaling advancement from earlier challenges.  More significantly, Tan said the improvements are beginning to attract customer interest, with Intel expecting commitments from multiple foundry customers in the second half of 2026, the report highlights. The remarks align with earlier comments from CFO David Zinsner, who said signals from external foundry customers would become “more concrete” in the second half of the year and into early 2027.  Intel Reportedly Pushes 18A CPUs Amid Supply Tightness  Recent CPU shortages have also brought renewed attention to Intel, which is reportedly promoting processors built on its 18A technology. According to Nikkei, sources say Intel is encouraging key PC partners across the U.S., China, and Taiwan to increase adoption of CPUs produced using the process, which only became available late last year.  Sources add that the company has prioritized supply of chips based on its older Intel 7 process for server and industrial applications. Intel’s push to promote its most advanced chips comes as it seeks to capitalize on the AI race and regain leadership in advanced chipmaking, the report adds.  14A Seen as Intel’s Next Push Against TSMC  Beyond 18A, according to CNBC, Tan said Intel’s next-generation 14A process could eventually compete with TSMC, adding that it is expected to arrive around the same time as TSMC’s comparable technology — a development he described as a “major, major breakthrough.” As noted by Wccftech, Tan said Intel expects risk production for its 14A technology in 2028, followed by volume production in 2029, placing its timeline alongside TSMC’s. He added that multiple customers are already engaging with Intel as the company has made its 0.5 PDK available.  EMIB Shows Early Customer Commitment as Substrate Prepayments Emerge  Another major technology highlighted by Lip-Bu Tan is EMIB, which he described as one of the most advanced chip packaging technologies. According to Wccftech, Tan said customer commitment has become evident, with some customers even prepaying for substrates to secure supply amid ongoing shortages.  Wccftech notes that EMIB was recently said to have reached 90% yields. By contrast, Commercial Times notes that TSMC’s CoWoS currently mass-produced 5.5-reticle-size version — the world’s largest today — has already achieved yields of 98%.
2026-05-20 11:32 reading:351
First Intel Wildcat Lake Laptops Near Launch; Reportedly Built on 18A, Taking Aim at Apple’s MacBook Neo
  The first laptops powered by Intel’s “Wildcat Lake” Core Series 300 processors for the entry-level PC segment are reportedly nearing launch. According to Wccftech, Intel Core Series 3 laptops could hit retail shelves as early as next week, with initial models including 14-inch and 16-inch designs from Honor and ASUS, while more OEMs are expected to follow.  Chinese media outlet Mydrivers notes that the Honor Notebook X14 2026 Combat Edition will be the first commercially available laptop based on Intel’s Wildcat Lake platform, featuring an Intel Core 5 320 processor. Another Wccftech report notes that the device comes with 16GB of LPDDR5X 7467 MT/s memory, double the capacity of Apple’s MacBook Neo, along with a 512GB SSD. By comparison, the Neo starts at 256GB of storage and tops out at 512GB.  Intel’s Wildcat Lake Targets AI PCs With Better Battery Life  The SoC package integrates two dies, with the primary die built on Intel’s 18A node, according to TechPowerUp. This die features a 6-core CPU configuration, NPU 5 delivering 40 TOPS of INT8 performance, and a GPU with up to two Xe3 cores. It also integrates the memory controller and cache pool. Meanwhile, Intel dedicates the second die to I/O functions, the report adds.  Wccftech notes that Intel’s Core Series 3 emphasizes AI capability and battery efficiency, marking the company’s first hybrid AI-ready Core Series processor. The report adds that the chips are designed for all-day battery life and everyday productivity, offering up to 2.1 times faster creation and productivity performance, up to 64% lower processor power consumption, and up to 2.7 times higher AI GPU performance compared with previous-generation Intel Core 7 150U processors.  Looking ahead, Wildcat Lake could see broader adoption across future devices. TechPowerUp reports that Google is likely to pair its rumored “Googlebook” laptops with Intel’s latest Core Series 300 “Wildcat Lake” processors. However, Intel is not expected to be the exclusive platform provider, with Qualcomm and MediaTek also said to be among Google’s partners.
2026-05-19 10:42 reading:399
Intel’s Next Gen CPU to Produce at TSMC with 3nm in First Half of Next Year
  Intel’s upcoming Lunar Lake platform has entrusted TSMC with the 3nm process of its CPU. This marks TSMC’s debut as the exclusive producer for Intel’s mainstream laptop CPU, including the previously negotiated Lunar Lake GPU and high-speed I/O (PCH) chip collaborations. This move positions TSMC to handle all major chip orders for Intel’s crucial platform next year, reported by UDN News.  Regarding this news, TSMC refrained from commenting on single customer business or market speculations on November 21st. Intel has not issued any statements either.  Recent leaks of Lunar Lake platform internal design details from Intel have generated discussions on various foreign tech websites and among tech experts on X (formerly known as Twitter). According to the leaked information, TSMC will be responsible for producing three key chips for Intel’s Lunar Lake—CPU, GPU, and NPU—all manufactured using the 3nm process. Orders for high-speed I/O chips are expected to leverage TSMC’s 5nm production, with mass production set to kick off in the first half of next year, aligning with the anticipated resurgence of the PC market in the latter half of the year.  While TSMC previously manufactured CPUs for Intel’s Atom platform over a decade ago, it’s crucial to note that the Atom platform was categorized as a series of ultra-low-voltage processors, not Intel’s mainstream laptop platform. In recent years, Intel has gradually outsourced internal chips, beyond CPUs, for mainstream platforms to TSMC, including the GPU and high-speed I/O chips in the earlier Meteor Lake platform—all manufactured using TSMC’s 5nm node.  Breaking from its tradition of in-house production of mainstream platform CPUs, Intel’s decision to outsource to TSMC hints at potential future collaborations. This move opens doors to new opportunities for TSMC to handle the production of Intel’s mainstream laptop platforms.  It’s worth noting that the Intel Lunar Lake platform is scheduled for mass production at TSMC in the first half of next year, with a launch planned for the latter half of the year, targeting mainstream laptop platforms. Unlike the previous two generations of Intel laptop platforms, Lunar Lake integrates CPU, GPU, and NPU into a system-on-chip (SoC). This SoC is then combined with a high-speed I/O chip, utilizing Intel’s Foveros advanced packaging. Finally, the DRAM LPDDR5x is integrated with the two advanced packaged chips on the same IC substrate.
2023-11-22 11:18 reading:2610
Intel’s CEO Envisions Over One Hundred Million AI PC Shipments in Two Years
  On November 7th, Intel held its “Intel Innovation Taipei 2023 Technology Forum”, with CEO Pat Gelsinger highlighting the healthy state of PC inventory. He also expressed optimism about the injection of several more years of innovative applications and evolution in PCs through AI.  Intel Aims to Ship over One Hundred Million AI PC within the Next Two Years  Gelsinger expressed that the PC inventory has reached a healthy level, and he is optimistic about the future growth of AI PCs, which are equipped with AI processors or possess AI computing capabilities. He anticipates that AI will be a crucial turning point for the PC industry.  Additionally, Gelsinger stated that the server industry may have seemed uneventful in recent years, but with the accelerated development of AI, it has become more exciting. AI is becoming ubiquitous, transitioning from the training phase to the deployment phase, and various platforms will revolve around AI.  Gelsinger expressed his strong confidence in Intel’s position in the AI PC market, expecting to ship over one hundred million units within two years.  Intel’s Ambitious Expansion in Semiconductor Foundry Landscape  Intel is actively promoting its IDM 2.0 strategy, with expectations from the industry that the company, beyond its brand business, has advanced packaging capabilities to support semiconductor foundry operations. In the future, Intel is poised to compete with rivals such as TSMC and Samsung.  Gelsinger noted that some have viewed Intel’s plan of achieving five technical nodes in four years as “an ambitious endeavor.” However, he emphasized that Intel remains committed to its original goal of advancing five process nodes within four years.  The company’s foundry business has received positive responses from numerous potential customers, and while it may take three to four years for significant expansion, the advanced packaging aspect may only require two to three quarters to get on track.  This transformation marks a significant shift for the company, setting new standards in the industry. Intel is making steady progress in its four-year plan to advance five nodes, and Moore’s Law will continue to extend. The construction of Intel’s new factories is also ongoing.  According to Intel’s roadmap, Intel 7 and Intel 4 are already completed, Intel 3 is set for mass production in the latter half of this year, and Intel 20A and 18A are expected to enter mass production in the first and second halves of next year, respectively.
2023-11-08 16:10 reading:2155
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
RB751G-40T2R ROHM Semiconductor
TL431ACLPR Texas Instruments
CDZVT2R20B ROHM Semiconductor
MC33074DR2G onsemi
BD71847AMWV-E2 ROHM Semiconductor
model brand To snap up
TPS63050YFFR Texas Instruments
IPZ40N04S5L4R8ATMA1 Infineon Technologies
ESR03EZPJ151 ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
BU33JA2MNVX-CTL ROHM Semiconductor
BP3621 ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 weixin Service Account AMEYA360 weixin Service Account
AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below:

verification code