Apple Reportedly Keeps 2nm <span style='color:red'>5G</span> Modem Orders with TSMC Amid Intel Cooperation Signals
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Apple Reportedly Keeps 2nm 5G Modem Orders with TSMC Amid Intel Cooperation Signals

　　While recent market chatter has focused on a potential shift by Apple between longtime foundry partner TSMC and Intel, the Economic Daily News, citing industry sources, reports that the Cupertino-based company remains heavily dependent on the Taiwanese foundry giant, as it plans to place its entire in-house 5G modem orders with TSMC, leveraging its 2nm process technology.　　The report suggests that Apple’s self-developed 5G modem chips are expected to power future iPhone, iPad, and Apple Watch devices, replacing modems from Qualcomm. The volume used across its product lineup is projected to reach hundreds of millions of units, the report adds.　　Notably, Apple’s iPhone 17 lineup is expected to be the last to ship with Qualcomm Incorporated’s 5G modems, as the company moves toward a full transition to its in-house C2 baseband chip across all iPhone 18 models, according to Wccftech.　　The C2 development builds on Apple’s earlier in-house modem effort. Apple’s C1, first introduced in early 2025 with the iPhone 16e, marked its most complex chip system to date, integrating a 4nm baseband modem and a 7nm transceiver, according to earlier reporting from Reuters. The Economic Daily News further reports that Apple Inc.’s in-house C2 5G modem is expected to add full mmWave support—addressing the Sub-6 GHz limitation of its predecessor—while also incorporating satellite connectivity.　　Supply chain sources cited in the Economic Daily News report say TSMC has already secured foundry orders for Apple’s modem chips. Its back-end testing partner is also reportedly preparing for higher demand, with around 600 test systems being procured, as capacity is set to ramp from 2027.　　Apple’s Chip Tug-of-War: TSMC vs Intel　　Though claims of an Apple order shift to Intel remain unconfirmed, and any such move would not signal a departure from TSMC, cooperation between Apple and Intel appears to be warming. According to The Wall Street Journal, the two companies have reportedly reached a preliminary agreement for Intel to manufacture some of the chips powering Apple devices.　　The two sides have been engaged in intensive talks for more than a year, with a formal deal said to have been hammered out in recent months, the report adds.　　In parallel, Commercial Times reported earlier that Apple is evaluating Intel’s 18A-P process for its M-series chips. Looking further ahead, The New 7 reports that the first Intel-manufactured low-end M-series chips could emerge as early as mid-2027 under contract production, likely targeting entry-level Macs or iPads.　　As highlighted by The Wall Street Journal, Apple’s reported outreach to Intel may reflect growing supply chain pressures, as the Cupertino firm—long TSMC’s top customer—faces tightening access to advanced manufacturing capacity amid surging demand from NVIDIA and other AI chip designers.　　Intel previously played a central role in powering Apple’s Mac lineup, before Apple transitioned in 2020 to its own Arm-based custom chips, the report points out.
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Release time：2026-05-11 11:12 reading：439 Continue reading>>
SIMCom丨SIM8260 series Achieves Global Certifications, Delivering High-Performance <span style='color:red'>5G</span> Connectivity
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SIMCom丨SIM8260 series Achieves Global Certifications, Delivering High-Performance 5G Connectivity

　　SIMCom, a global leader in IoT communication and solutions, proudly announces that its SIM8260 Series 5G modules have successfully obtained a wide range of international certifications, including CE, RCM, FCC, IC, JATE, TELEC, GCF, PTCRB, T-Mobile, Verizon, Deutsche Telekom, Orange, RoHS, REACH. These certifications demonstrate the SIM8230 series’ compliance with global standards and network requirements, ensuring smooth deployment across worldwide markets.　　Built on the Qualcomm® Snapdragon™ X62 chipset platform, the SIM8260 series are a multi-band 5G Release 16 module supporting NR, LTE-FDD, LTE-TDD, and HSPA+ in both NSA and SA modes. With its advanced capabilities, the SIM8260 series enable fast, stable, and secure mobile broadband connections for a wide range of industrial and commercial applications.　　The SIM8260 series achieve outstanding data rates across multiple network environments. On 5G Sub-6G SA, it supports download speeds of up to 2.4Gbps and upload speeds of up to 1Gbps, while in 5G Sub-6G NSA mode it can reach 3.4Gbps (DL) and 600Mbps (UL). For LTE networks, peak speeds of 1.6Gbps downlink and 200Mbps uplink are supported, and on HSPA+, the module achieves 42Mbps (DL) and 5.76Mbps (UL). These capabilities ensure stable, high-capacity communication to meet the demands of data-intensive IoT and enterprise applications.　　Beyond performance, the SIM8260 series offer robust expansion capabilities with a wide range of interfaces including PCIe, USB 3.1, and GPIO, enabling flexible integration into customer solutions, reduce development costs, and accelerate time-to-market.　　With its combination of high throughput, flexible integration, and proven security, the SIM8260 series are ideally suited for use cases such as smart manufacturing, connected vehicles, customer premises equipment (CPE), robotics, and other next-generation IoT solutions.　　The achievement of comprehensive global certifications underscores the SIM8260 series’ in large-scale international deployment. These approvals not only confirm compliance with stringent regulatory, safety, and environmental standards, but also guarantee broad operator interoperability across regions. For customers, this means accelerated product launches, reduced deployment risks, and greater confidence in global scalability.
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Release time：2026-01-23 16:51 reading：760 Continue reading>>
Fibocom Debuts <span style='color:red'>5G</span> Module FG390 Powered by MediaTek T930 Platform, Accelerating FWA Innovation with the Convergence of <span style='color:red'>5G</span>-A and AI
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Fibocom Debuts 5G Module FG390 Powered by MediaTek T930 Platform, Accelerating FWA Innovation with the Convergence of 5G-A and AI

　　Fibocom, a global leading provider of wireless communication modules and AI solutions, announces the launch of its 5G module FG390, developed on the advanced MediaTek T930 platform. Designed specifically for mobile broadband (MBB) terminal products focused on 5G Fixed Wireless Access (FWA), the FG390 series seeks to boost FWA industry growth across diverse applications such as CPEs, ODUs, mobile hotspot devices, enterprise gateways, and industrial gateways.　　FG390 is a highly integrated, high-performance 5G module built on MediaTek’s advanced T930 chipset, featuring cutting-edge 4nm process technology. It incorporates the MediaTek M90 5G modem alongside a quad-core ARM Cortex-A55 CPU, delivering robust functionality and full compliance with 3GPP Release 18 standards. Supporting downlink 6-carrier aggregation (6CC CA) and uplink 5-layer 3Tx transmission within the 5G NR Sub-6GHz spectrum, the FG390 achieves peak standalone (SA) downlink speeds of up to 10 Gbps and uplink speeds reaching 2.8 Gbps, providing an outstanding high-speed 5G experience. Furthermore, with 200MHz bandwidth and 8Rx technology, the module significantly enhances spectrum efficiency about 40% at cell edges, greatly extending signal coverage. Paired with a dedicated NPU chip, the FG390 powers AI-enabled gateway devices to offer advanced, intelligent network interaction capabilities.　　Amid the swift convergence of 5G-A and AI technologies, the FG390 series harnesses cutting-edge specifications, innovative features, and a comprehensive suite of peripherals to drive digital transformation and continuous innovation across both residential and enterprise applications. This breakthrough empowers telecom operators and the broader market to enhance investment efficiency and accelerate returns in the communications terminal sector.　　Leveraged by the MediaTek T930 platform, the FG390 seamlessly integrates robust 5G Release 18 protocol capabilities with exceptional cellular performance and AI-driven intelligence, setting a new benchmark for the next generation of mobile broadband terminals. Enhanced by a dedicated NPU for AI acceleration, this module empowers transformative applications across smart offices, smart homes, and smart cities. Fibocom remains dedicated to deepening the collaboration with MediaTek to drive continuous innovation in 5G technologies, products, and ecosystem development.
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Release time：2025-07-17 16:21 reading：1413 Continue reading>>
Fibocom Releases <span style='color:red'>5G</span> AI Mobile Hotspot Solution, Unlocking Intelligent Future for Mobile Broadband Devices
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Fibocom Releases 5G AI Mobile Hotspot Solution, Unlocking Intelligent Future for Mobile Broadband Devices

　　As 5G and AI technologies continue to converge, demand is growing for stable, high-speed, and intelligent mobile networks across various scenarios—from business travel and outdoor operations to global connectivity. Fibocom’s latest 5G AI Mobile Hotspot solution redefines the mobile broadband experience with cutting-edge technology and forward-thinking design.　　Powered by Qualcomm’s advanced 4nm QCM4490 platform, the solution combines smartphone-grade ultra-low power consumption with precision circuit design. This results in a powerful yet energy-efficient platform that balances high performance with cost optimization.　　In terms of connectivity, the solution supports 3GPP Release 16 and NR 2CC 120MHz. It delivers a downlink speed of up to 2.3 Gbps in SA mode and 2.5 Gbps in NSA mode. Customers can flexibly configure the solution with either AX3600-based Wi-Fi 6E or BE5800-based Wi-Fi 7 options. It supports dual-band simultaneous (DBS) modes of 2.4GHz+5GHz or 2.4GHz+6GHz, as well as high-band simultaneous (HBS) mode of 5GHz+6GHz.　　Tailored for Mobile Hotspot applications, the solution runs an optimized Android 13 OS, significantly boosting system performance while reducing power consumption. With USB 3.1 support and a theoretical data transfer rate of up to 5 Gbps, it’s well-suited not only for 5G Mobile Hotspot devices but also for other mobile broadband terminals such as USB dongles.　　Crucially, the solution leverages the QCM4490’s heterogeneous computing architecture, featuring a robust 8-core CPU (2x Cortex-A78 @ 2.4GHz + 6x Cortex-A55 @ 2.0GHz) and integrated Adreno 613 GPU (@ 1010MHz). Compared to GPU-less solutions, this powerful combination enables efficient on-device AI processing, expanding the possibilities for more edge intelligence applications. Internal tests have demonstrated the successful deployment of large-scale open-source AI models such as Qwen-1.8 B-Chat.　　From business office to global travel these mobile broadband applied scenarios, Fibocom’s cost-effective 5G AI Mobile Hotspot solution—with optional Wi-Fi 7 support—paves the way for a new era of AI-enhanced mobile broadband.
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Release time：2025-06-06 15:38 reading：1346 Continue reading>>
SIMCom Powers Smart Terminals with <span style='color:red'>5G</span> + Wi-Fi 7 for Commercial Applications
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SIMCom Powers Smart Terminals with 5G + Wi-Fi 7 for Commercial Applications

　　As AI-driven smart devices evolve, reliable connectivity remains essential for advanced applications. During MWC25 and EW25, SIMCom introduced its 5G + Wi-Fi 7 wireless communication solution, engineered for smart router applications. This solution delivers solid performance, fast speeds, and dependable wireless communication, and it is already being used in commercial products to help manufacturers optimize both cost and time-to-market.　　5G + Wi-Fi 7: Unlocking the Full Potential of Smart Terminals　　Based on the Qualcomm® Snapdragon™ X62 5G Modem-RF System, a key component of the world's first 3GPP Release 16 modem-RF family. Designed with an upgradable architecture, this technology enables rapid commercialization of 5G Release 16, extending 5G connectivity to various applications, including mobile broadband, fixed wireless, industrial IoT, and private 5G networks. By integrating Wi-Fi 7, this solution enhances the wireless experience for smart devices, providing higher capacity, lower latency, and greater efficiency.　　Showcasing Real-World Applications　　During MWC25 and EW25 , SIMCom partnered with LUXSHARE ICT to demonstrate the real-world capabilities of 5G + Wi-Fi 7. A key highlight was the 5G CPE BE17000 Wi-Fi 7 Mesh Router, featuring SIMCom's SIM8262E-M2 module. By inserting a 5G SIM card, this router utilizes advanced 5G connectivity, allowing users to share ultra-fast networks with multiple Wi-Fi devices. The Wi-Fi 7 Mesh technology further enhances:　　● Network coverage and capacity　　● Ultra-HD streaming without buffering　　● Lightning-fast file downloads　　● Seamless video conferencing and online collaboration　　This deployment underscores SIMCom's commitment to delivering high-speed, uninterrupted connectivity for AI-driven applications, addressing the increasing demand for reliable smart networking solutions.　　( 5G CPE BE17000 WiFi 7 Mesh Router with LUXSHARE ICT )　　Global 5G Adaptability for Diverse Market Needs　　One of the key advantages of SIMCom’s 5G + Wi-Fi 7 solution is its ability to support both NSA and SA network architectures, ensuring robust cellular performance and high data transmission rates. The Snapdragon X62 5G Modem-RF System enables full compatibility with global 5G frequency bands, covering high, mid, and low spectrum ranges. This allows SIMCom to offer customized regional solutions, catering to the specific connectivity requirements of different global markets.　　Driving the Future of Smart Connectivity　　With the integration of 5G and Wi-Fi 7, SIMCom is revolutionizing AI-powered smart terminals, enabling faster, more intelligent, and always-connected experiences. As AI-driven applications continue to expand, high-speed, stable, and adaptive connectivity will play a pivotal role in unlocking new possibilities across industries.　　By leading the way in advanced 5G and Wi-Fi solutions, SIMCom empowers device manufacturers, businesses, and end users to fully embrace the next generation of smart, connected experiences.　　About LUXSHARE ICT:　　Established on May 24, 2004, Luxshare Precision successfully listed on the ChiNext Board of Shenzhen Stock Exchange on September 15, 2010 (stock code: 002475). The Company is committed to providing integrated intelligent solutions, parts, modules and systems for enterprise communication products (high-speed interconnect, optical module, heat dissipation module, base station antenna, base station filter), consumer electronic products (TWS wireless headphones, smart wear, wireless charging module, 5G router, VR headsets, smart speaker), and automobile systems (automobile wiring harness, connector, intelligent cabin, intelligent driving) and central gateway, etc　　About SIMCom:　　SIMCom Wireless Solutions Limited is a global leading IoT wireless modules and solutions supplier. Since established in 2002, SIMCom has been fully committed to providing a variety of wireless modules and terminal level solutions worldwide, such as 5G,4G, LTE-A, LTE-M(CAT-M1), NB-IoT, 3G, 2G, and GPS/GLONASS/BEIDOU satellite positioning technology.　　SIMCom insists on providing high-quality modules and industry solutions. With 23 years of professional technical innovation and service experiences, it continuously meets the needs of customers in all industries of the Internet of Things. While deepening the vertical industry, we continue to define advantageous products and build core competitiveness. With the Group's continuous investment in research and development, technology and production, we will continue to innovate and enrich our technology roadmap, and promote the development of the industry in the next few years.
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Release time：2025-03-20 13:58 reading：836 Continue reading>>
MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 <span style='color:red'>5G</span> Modem-RF-Powered <span style='color:red'>5G</span> Modules, Enhancing FWA AI Capabilities
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MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities

　　Barcelona, Spain – March.4th 2025 - Fibocom (Stock code:300638), a global leading provider of AIoT solutions and wireless communication modules, announced the launch of its new 5G modules and solutions based on Qualcomm Technologies, Inc.s latest Qualcomm® X85/X82 5G Modem-RF. These new solutions are set to help industry customers seamlessly transition to next-generation Fixed Wireless Access (FWA) technologies and rapidly accelerate the commercialization of new platforms.　　The latest Qualcomm X85/X82 5G Modem-RF delivers significant performance upgrades over the previous X75/X72 generation, including:　　l Supports 3GPP 5G Advanced standards, enabling key 5G Advanced features.　　l Enhanced NR Sub-6GHz downlink carrier aggregation (CA), upgraded from 5CA to 6CA, with carrier bands exceeding 400 MHz.　　l Support for Intra-band ULCA (uplink carrier aggregation) TDD, boosting uplink data rates and optimizing network efficiency.　　l Advanced software capabilities, supporting OpenWRT version 24.x, with compatibility for RDK-B and prplOS.　　l Major AI advancements, including Modem AI functionality and support for external AI NPUs (Neural Processing Units).　　Powered by a quad-core processor, new software suite, and several industry-leading innovations, Fibocom’s 5G modules deliver remarkable capabilities in network coverage, latency, energy efficiency, and mobility. Harnessing advanced AI capabilities, these modules drive 5G FWA solutions to an unprecedented level of intelligence.　　These 5G modules support six-carrier aggregation in the NR Sub-6GHz downlink, offering bandwidth exceeding 300 MHz for faster transmission speeds and broader signal coverage. In addition, Intra-Band uplink carrier aggregation ensures faster data rates, optimizing overall network performance and addressing bandwidth-intensive applications like video conferencing, online gaming, and virtual collaboration.　　In addition to hardware upgrades, the Qualcomm X85 Modem-RF introduces software innovations. The modules will support OpenWRT 24.x, a popular open-source router operating system known for robust features and scalability. Support for RDK-B and prplOS provides users with the flexibility to select the platform that best suits their needs.　　The Qualcomm® 5G AI Suite and Qualcomm® Networking AI Suite combine to deliver QoS management and intelligently prioritized network traffic. These powerful AI Suite capabilities automatically identify high-priority tasks—such as streaming HD video or online gaming—and allocate necessary bandwidth, significantly enhancing the user experience.　　“We are thrilled to collaborate with Fibocom on the launch of their new 5G modules and solutions, powered by our latest Qualcomm X85/X82 5G Modem-RF. Together, we are proud to set new benchmarks with solutions offering exceptional network coverage, low latency, energy efficiency, and enhanced mobility, ultimately paving the way for a more connected and efficient future,” said Gautam Sheoran, VP & GM, Wireless Broadband & Communications, Qualcomm Technologies, Inc.
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Release time：2025-03-20 13:55 reading：1305 Continue reading>>
SIM8230: Advanced and Flexible <span style='color:red'>5G</span> Connectivity for Demanding IoT Applications
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SIM8230: Advanced and Flexible 5G Connectivity for Demanding IoT Applications

　　The 5G RedCap specification, introduced in version R17 of the 3GPP standard, addresses the growing need for efficient connectivity in IoT devices that do not require the full performance of 5G. Also known as "Reduced Capability," this technology offers a more cost-effective and energy-efficient alternative to 4G, LTE-M, and NB-IoT.　　RedCap provides an optimal balance between speed and energy efficiency, making it ideal for applications that demand constant connectivity without requiring maximum 5G capacity.　　The SIM8230 module from SIMCom fits perfectly into this context, offering multi-band compatibility, intensive data transmission, and easy integration into IoT devices. Its efficient design meets the needs for economical connectivity, providing a viable solution for a wide range of IoT applications.　　The SIM8230 is a multi-band 5G NR/LTE-FDD/LTE-TDD module that supports 5G SA according to version R17 (3GPP), providing advanced connectivity capabilities. It stands out for its compatibility with a wide range of protocols, facilitating integration into various platforms.　　Compact and Easy to Integrate　　Equipped with interfaces like PCIe, USB 2.0, and GPIO, the SIM8230 offers developers great flexibility to customize their projects. Its LGA format optimizes design and installation, allowing for a more durable assembly and improving heat dissipation, saving space and simplifying installation.　　Rapid 5G Implementation with Minimal Reprogramming　　The compatibility of the SIM8230’s AT commands with the SIM7600/8200/8260 series reduces costs and accelerates time to market. This is especially advantageous for companies that need to implement 5G solutions quickly without requiring extensive reprogramming.　　Additionally, the SIM8230 is based on the Qualcomm X35 platform, which introduces the world's first 5G NR-Light modem-RF system, designed to enhance connectivity at the intelligent edge. This optimized architecture combines energy efficiency and lower complexity design, allowing compact devices to make the most of 5G connectivity. Thanks to its energy- saving features and improved performance, the X35 not only facilitates a smooth migration from LTE CAT-4+ devices but also enables a new wave of use cases for IoT devices, facilitating the rollout of 5G solutions with minimal reprogramming.　　Technical Specifications of the SIM8230　　- The SIM8230 is available in different regional versions to adapt to connectivity needs in various markets: The SIM8230C, SIM8230E, SIM8230G, SIM8230JP, SIM8230NA, and SIM8230SA models are presented in an LGA+LCC format with dimensions of 30.0x30.0x2.5 mm, optimized for compact devices. For M2 formats, the SIM8230C-M2, SIM8230E-M2, SIM8230G-M2, and SIM8230JP-M2 models have dimensions of 42.0x31.4x3.4 mm. Additionally, the SIM8230C-PCIE, SIM8230E-PCIE, SIM8230G-PCIE, and SIM8230JP-PCIE models are available in PCIe format with dimensions of 50.8x31.0x3.6 mm.　　- Supported Frequencies: 5G NR (Sub6G), LTE-FDD, LTE-TDD.　　- GNSS: Compatibility with global navigation systems, ideal for geolocation applications (GPS/GLONASS/BeiDou).　　- Temperature Range: Operates between -40℃ and +85℃, ensuring reliability in extreme weather conditions.　　- Electrical Characteristics: Operates with a voltage of 3.3 to 4.4 V, providing wide compatibility.　　- Data Transfer Performance: Sub-6G SA with speeds of up to 220 Mbps download and 100 Mbps upload; LTE with up to 200 Mbps download and 75 Mbps upload, providing solid performance on LTE networks.　　- Software Functions: Support for protocols such as TCP/IP, IPV4, IPV6, Multi-PDP, FTPS, HTTPS, MQTTS, and DNS, as well as USB/FOTA functionality for remote firmware updates.　　- Interfaces and Connectivity: Includes interfaces such as USB, UART, PCM, GPIO, I2C, and PCIe. Supports SIM cards of 1.8V/2.95V, expanding its compatibility.　　- Certifications: The SIM8230 is currently in the process of obtaining international certifications such as CE (RED), FCC, GCF, PTCRB and MNO TA.　　Versatile and Robust Applications　　The SIM8230 stands out as a key module in CPE and MiFi applications, offering efficient 5G connectivity and FWA access that meet the needs of both industrial and residential sectors. Its optimized design and low energy consumption make it ideal for remote environments, providing high-speed internet access in MiFi devices and converting 5G signals into WiFi in CPE installations.　　Moreover, its versatility makes it a preferred option for emerging sectors such as telemedicine, smart cities, and connected automotive, opening new possibilities for innovative IoT solutions. Its high efficiency, security, and flexibility make it an adaptable solution for future demands, ensuring fast and reliable connections in an increasingly interconnected world.
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Release time：2024-12-19 10:34 reading：1187 Continue reading>>
Fibocom Fosters Local <span style='color:red'>5G</span> AIoT Market with Newly Launched <span style='color:red'>5G</span> Module FG370-KR at AIoT Korea 2024
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Fibocom Fosters Local 5G AIoT Market with Newly Launched 5G Module FG370-KR at AIoT Korea 2024

　　wireless communication modules, announces the launch of FG370-KR, a regional version of the FG370 series module, which is positioned to accelerate the commercial development of Korean’s 5G AIoT industries such as Fixed Wireless Access (FWA), live streaming, and industrial automation, etc. By adopting the advancements from FG370-KR, the solution allows local customers to benefit from the seamless 5G experience and fast-to-market industry solutions.　　5G subscribers in South Korea reached around 33 million as of the end of March 2024, according to the latest report from Statista. SK Telecom accounted for 15.9 million of the total 5G subscribers, followed by KT with 9.9 million and LG U+ with 7.2 million. At present, the country accelerates the rollout of commercial 5G services to industry-related field and shows strong growing trends. Fibocom's 5G Sub-6GHz module FG370-KR is compatible with Korea's mainstream 5G frequency bands, supports both 5G SA and NSA network architecture, making it an ideal 5G solution for industry customers that require high-transmission speed, large capacity, and ultra-low latency.　　Developed from the MediaTek T830 chipset platform, the FG370-KR is a 3GPP Release 16 compliant module that adopts a 4nm process integrated with an Arm Cortex-A55 quad-core CPU, leading to a 10% improvement in speed performance compared to the previous generation. In terms of data transmission, FG370-KR supports NR 4CA (Carrier Aggregation) with up to 300MHz bandwidth on the downlink, and NR 2CA in FDD and TDD hybrid mode on the uplink, reaches a maximum speed of up to 7.01Gbps DL and 1.25Gbps UL. In addition, it also supports PC2 of HPUE (High Power User Equipment) technology, significantly enhances 5G uplink capability and network coverage. It is worth highlighting that, FG370-KR can greatly reducing the time-to-market of customers’ devices with the support of a wide range of peripheral interfaces, including three PCI-Express, USB 3.2, two USXGMII interfaces along with software features such as Kernel, OpenWRT drivers.　　“The launch of the FG370-KR signifies that Fibocom will provide a Korea-dedicated solution for local customers, boosting the 5G adoption towards a larger-scale of industries with optimal network connectivity and enhanced operational efficiency, said Simon Tao, VP of Product Management Dept., Head of MBB BU at Fibocom. “We have the confidence in helping enterprises to accomplish the 5G commercialization with our industry know-how and expertise accumulated, without doubt, Korea’s 5G deployment will keep experiencing a fast-growing rate and Fibocom will continually invest in cutting-edge 5G module solutions and delivering superior wireless experience.”　　To learn more about 5G Sub-6GHz module and its demos, welcome to visit Fibocom booth #G101 on the 3rd Floor of Hall D in COEX at the AIoT Korea from October 30 to November 1 2024.
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Release time：2024-12-13 10:55 reading：1699 Continue reading>>
Fibocom Accelerates <span style='color:red'>5G</span> RedCap FWA Commercialization by Offering Wi-Fi-Ready Solutions
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Fibocom Accelerates 5G RedCap FWA Commercialization by Offering Wi-Fi-Ready Solutions

　　Shenzhen,China – November 25th 2024 – Fibocom (Stock code: 300638), a global leading provider of wireless communication modules and solutions, today debuts the ready-to-market 5G RedCap plus Wi-Fi 5/6 solution developed from the 5G RedCap module FG131, which is positioned to accelerate the commercialization of 5G FWA in the form of CPE, mobile hot-spot, and USB dongle, etc., satisfying the diverse market demands.　　According to a report updated in September 2024, GSA has identified 143 operators in 61 countries and territories worldwide that have been investing in public 5G SA networks through trials, planned or actual deployments. With the implementation of 5G SA network infrastructure, 5G-enabled FWA shipments became mainstream, reaching 10.2 million in 2023. The growth of 5G FWA CPE shipments is expected to accelerate further, accounting for 42% of shipments in 2024 compared with 34% in 2023, according to the CPE Vendor Survey released by GSA in August 2024.The launch of Fibocom’s ready-to-market 5G RedCap plus Wi-Fi 5/6 solution is the ideal 5G lightweight solution accelerating the migration from 4G FWA to 5G FWA, elevating the Quality-of-Service with faster network connection, more-agile network slices services and reliability in 5G SA network environment.　　Key takeaways　　Advanced 5G RedCap plus Wi-Fi 6 (AX3600): The FG131 5G RedCap module integrates with a Wi-Fi 6 module developed from the Qualcomm WCN6856, reaching maximum 3600Mbps data throughput with the support of 2x2-40MHz@2.4GHz and 2x2-160MHz@5/6GHz dual-band concurrently and the support of 4K QAM for enhanced data transmission efficiency.　　Medium 5G RedCap plus Wi-Fi 6 (AX1800): The FG131 5G RedCap module integrates with a Wi-Fi 6 module developed from the Qualcomm QCA2064, reaching maximum 1800Mbps data throughput with the support of 2x2-40MHz@2.4GHz and 2x2-80MHz@5/6GHz dual-band concurrently.　　Entry-level 5G RedCap plus Wi-Fi 5: The FG131 5G RedCap module integrates with a Wi-Fi module developed from the Qualcomm QCA6174 through a serial port, delivers maximum 867Mbps speed with the support of dual-band 2.4GHz and 5GHz simultaneously.　　Leveraging 5G SA network coverage, optimized power-saving, and reduced complexity, 5G RedCap is gaining more and more attention within the IoT industry. The Fibocom5G RedCap module FG131 offers a high-performance and ultra-reliable wireless solution for application scenarios that are cost-sensitive and power-enduring. Packaged in LGA form factor at the size of 37mm*39.5mm, Fibocom FG131 is pin-compatible with Fibocom LTE Cat 6 module FG101 and FG621 series that allows smooth migration from 4G to 5G RedCap. Compliant with 3GPP Release 17, it supports 5G SA and reaches peak rates of up to 223Mbps downlink and 123Mbps uplink theoretically. With these key features combined, the Fibocom 5G RedCap module FG131 series delivers a new level of 5G network experience while maintaining high reliability and cost-effectiveness, especially for terminal devices used in mobile scenarios. Apart from the hardware optimization, FG131also supports the OpenCPU and OpenWRT software features and an abundant of rich interfaces to realize the flexible and easy integration of FWA devices.
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Release time：2024-12-11 13:26 reading：1602 Continue reading>>
simcom：MWC Shanghai 2024: A New Avenue for <span style='color:red'>5G</span> Popularization
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simcom：MWC Shanghai 2024: A New Avenue for 5G Popularization

　　Under the theme "Future First," as we all know, 5G-Advanced is the next step in the evolution of cellular technologies, enabling advanced use cases for various verticals such as government and security, transportation, oil and gas, airlines and logistics, and healthcare to realize the full potential of 5G.　　As a hallmark technology of 5G evolution, RedCap has garnered extensive attention from the industry since its inception during MWC Shanghai. 5G RedCap offers advantages such as lowering the complexity, cost, size, and power consumption of 5G products. This not only fills the middle ground of 5G capabilities but also opens a new avenue for 5G to empower various industries.　　At MWC Shanghai, SIMCom aims at 5G ultra-high-speed scenarios and has the 5G module series SIM8270 and SIM8390, providing a maximum speed of over 10Gbps. These modules are suitable for applications that have strict requirements on speed and latency, such as broadband access, video monitoring and industrial control.　　Also, SIMCom has launched the SIM8230 and SIM8230-M2 series RedCap modules based on the Qualcomm platform. The SIM8230 module supports multi-frequency bands for 5G R17 SA, comes with a variety of functional interfaces for external device expansion, and boasts advantages such as lightweight, energy efficiency, compactness, and cost-effectiveness. It can be widely utilized in various domains including 5G CPE, wearable devices, industrial routers, high-definition streaming devices, AR/VR, drones, and remote-controlled robots.　　SIMCom has already fully deployed and accelerated the commercial scale of 5G RedCap. As market recognition of RedCap technology continues to increase, the popularization of 5G will further accelerate. SIMCom is committed to developing more diverse and reliable products based on advanced technology, promoting the large-scale commercialization of technologies like 5G RedCap, and contributing to the digital transformation and development of various industries with 5G technology.
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Release time：2024-08-27 15:56 reading：1554 Continue reading>>

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Qr code of ameya360 official account

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AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

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