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Micron More Upbeat on Outlook, Reportedly Sets 2027 HBM4E Ramp with TSMC for Standard, Custom Logic Dies

　　Two months after its March earnings call, Micron is turning more upbeat on its outlook, while providing additional details on its custom HBM development progress. At the J.P. Morgan 54th Annual Global Technology, Media and Communications Conference, Micron’s Global Operations EVP Manish Bhatia, via STOCK Analysis transcript, said the company’s first HBM4E will be a JEDEC-standard product, with ramp-up scheduled for 2027.　　While Micron is still using 1-beta DRAM for HBM4, Bhatia said the company is expected to transition to 1-gamma DRAM in the HBM4E era. He also confirmed that the logic dies for both standard and custom HBM4E are expected to be manufactured by TSMC.　　When asked about the margin profile of customized products, Bhatia, according to STOCK Analysis, highlighted that value creation stems from multiple proprietary layers: design innovation, robust core DRAM development, and advanced packaging.　　He emphasized that customization represents the next evolution of this value expansion, and as the value increases, customers are expected to be willing to pay for the added customization.　　Improving Outlook vs. Previous Earnings Call　　According to Bhatia, Micron now expects tight conditions across HBM, DRAM, and NAND to persist well beyond 2026. Thus, he noted that the financial outlook has strengthened since the company’s last earnings call, and it is on track for another substantial record free cash flow in fiscal Q3.　　Notably, Bhatia pointed out that while pricing has largely played out as expected, demand remains very strong. He added that the AI ecosystem is shifting from human interactions to agentic and even machine-to-machine workflows, with these agentic workloads increasingly driving inference demand. As inference takes up a larger share of workloads, memory is increasingly seen as a strategic asset for customers, he said.　　Against this backdrop, Micron said in March that it had secured its first strategic customer agreement—a five-year deal with a large customer. Since then, the company has made meaningful progress on additional SCAs, with other customers also showing strong interest in establishing similar strategic relationships with Micron, including in NAND, Bhatia said.　　India Capacity Reported Booked up　　Amid tight demand, Bhatia also said Micron’s global expansion is accelerating. He noted that its Idaho 1 site is progressing well, with the company pulling forward its wafer output timeline from the second half of 2027 to mid-2027.　　Surging memory demand is also driving ramp-up at Micron’s new semiconductor assembly and test facility in Sanand, Gujarat, which began operations in late February. In a separate report by Business Standard, Micron’s entire memory production capacity in India has been fully booked amid strong demand.　　According to a previous Business Standard report, at full capacity, the facility could account for up to 10% of Micron’s global output, supplying both domestic and international markets.　　Sumit Sadana, executive vice-president and chief business officer at Micron, reportedly told Indian media outlet The Economic Times that the global semiconductor memory shortage triggered by the AI boom is proving far more severe than many companies currently anticipate, with the crunch potentially extending well beyond 2028 despite aggressive capacity expansion across the industry.

Key word：

Micron

Release time：2026-05-25 10:44 reading：139 Continue reading>>

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First Intel Wildcat Lake Laptops Near Launch; Reportedly Built on 18A, Taking Aim at Apple’s MacBook Neo

　　The first laptops powered by Intel’s “Wildcat Lake” Core Series 300 processors for the entry-level PC segment are reportedly nearing launch. According to Wccftech, Intel Core Series 3 laptops could hit retail shelves as early as next week, with initial models including 14-inch and 16-inch designs from Honor and ASUS, while more OEMs are expected to follow.　　Chinese media outlet Mydrivers notes that the Honor Notebook X14 2026 Combat Edition will be the first commercially available laptop based on Intel’s Wildcat Lake platform, featuring an Intel Core 5 320 processor. Another Wccftech report notes that the device comes with 16GB of LPDDR5X 7467 MT/s memory, double the capacity of Apple’s MacBook Neo, along with a 512GB SSD. By comparison, the Neo starts at 256GB of storage and tops out at 512GB.　　Intel’s Wildcat Lake Targets AI PCs With Better Battery Life　　The SoC package integrates two dies, with the primary die built on Intel’s 18A node, according to TechPowerUp. This die features a 6-core CPU configuration, NPU 5 delivering 40 TOPS of INT8 performance, and a GPU with up to two Xe3 cores. It also integrates the memory controller and cache pool. Meanwhile, Intel dedicates the second die to I/O functions, the report adds.　　Wccftech notes that Intel’s Core Series 3 emphasizes AI capability and battery efficiency, marking the company’s first hybrid AI-ready Core Series processor. The report adds that the chips are designed for all-day battery life and everyday productivity, offering up to 2.1 times faster creation and productivity performance, up to 64% lower processor power consumption, and up to 2.7 times higher AI GPU performance compared with previous-generation Intel Core 7 150U processors.　　Looking ahead, Wildcat Lake could see broader adoption across future devices. TechPowerUp reports that Google is likely to pair its rumored “Googlebook” laptops with Intel’s latest Core Series 300 “Wildcat Lake” processors. However, Intel is not expected to be the exclusive platform provider, with Qualcomm and MediaTek also said to be among Google’s partners.

Key word：

Intel Wildcat Lake

Release time：2026-05-19 10:42 reading：402 Continue reading>>

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YC Chem Reportedly First to Supply Glass Substrate Photoresists; Customer Eyes Year-End Mass Production

　　South Korea’s YC Chem has reportedly become the first in the industry to supply photoresists for glass substrates. According to The Elec, sources say the company is supplying i-line photoresist, stripper, and developer materials for glass substrates to a customer after receiving a purchase order (PO) following qualification tests.　　As supply of related materials begins to ramp up, commercialization of glass substrates also appears to be drawing closer, the report notes. Current shipments are intended for the customer’s prototype production, with material supply volumes expected to increase gradually as the customer moves toward mass production from the end of this year.　　The company is also seeking additional customers. According to the report, it is currently in discussions with more than three companies regarding the supply of glass substrate materials. With some firms, sample testing is underway for negative photoresists and glass substrate coating materials.　　YC Chem has also supplied prototype coating materials for glass substrates to customers. These materials are intended to minimize cracking and warpage caused by differences in thermal expansion coefficients (CTE) and thermal conductivity between glass and copper. According to the report, the products are currently undergoing qualification testing.　　The report notes that the coating materials are used in embedding-type glass substrates, which integrate circuits and passive components directly within the glass substrate itself.　　Key Requirements for Photoresists in Glass Substrate Manufacturing　　As the report points out, the glass substrate photoresist supplied by YC Chem is based on i-line technology, which uses a 365-nanometer (nm) mercury lamp wavelength in the lithography process. Notably, the report points out that, unlike extreme ultraviolet (EUV) photoresists used in advanced semiconductor manufacturing, glass substrate production places greater emphasis on thicker film thickness and strong etch resistance.　　In particular, the report states that through-glass via (TGV) processes require strong chemical durability and high etch resistance during hole formation and copper plating. As a result, demand is increasing for longer-wavelength lithography materials such as i-line and krypton fluoride (KrF)-based photoresists.　　In South Korea, Samyang NC Chem is also developing photoresist materials for glass substrates. The report adds that the company has supplied samples to more than two customers and is reportedly aiming for mass production next year.　　As major companies accelerate glass substrate development, securing stable material supplies is becoming increasingly important. A January Chosun Biz report said Absolics is diversifying suppliers by adding a domestic partner for glass substrate photoresists, reducing reliance on Japan’s TOK, while also reviewing process dualization for TGV and plating processes through additional collaborators.

Key word：

YC Chem

Release time：2026-05-18 13:05 reading：409 Continue reading>>

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Samsung Reportedly Develops Mobile HBM Packaging With Copper Pillars, Bandwidth Up 15%–30%

　　Samsung Electronics is reportedly developing a next-generation HBM packaging technology aimed at bringing high-performance on-device AI to mobile devices. According to ETNews, sources say the company is working on a “Multi Stacked FOWLP” technology that combines ultra-high-aspect-ratio copper pillars with FOWLP (Fan-Out Wafer Level Packaging) by advancing its existing VCS (Vertical Cu-post Stack) technology.　　The report notes that traditional mobile memory (LPDDR) packaging still relies on copper wire bonding. However, the technology is limited to roughly 128 to 256 I/O terminals, while also suffering from higher signal loss and lower thermal and power efficiency. To address these constraints, Samsung previously introduced its VCS (Vertical Cu-post Stack) technology, which arranges DRAM dies in a staircase-style stacked structure connected by copper pillars. The newly reported technology is viewed as a further evolution of this approach through the adoption of ultra-high-aspect-ratio copper pillars.　　More specifically, Samsung has increased the aspect ratio of copper pillars used in VCS packaging from 3–5:1 to 15–20:1, significantly boosting bandwidth, the report notes. However, copper pillars thinner than 10 micrometers become more vulnerable to bending and breakage. To address this issue, Samsung reportedly combined the design with an FOWLP process, which molds the chip and extends wiring outward to help support the copper pillars.　　The approach could enable more I/O terminals within the same area, potentially boosting bandwidth by 15% to 30% while increasing memory stack capacity by more than 1.5 times, the report adds.　　Commercialization Timeline Remains Unclear　　Meanwhile, the technology is still under development, making the timeline for mass production and commercialization unclear. However, the report says industry observers believe it could be adopted as early as a later version of the Exynos 2800 or the Exynos 2900.　　Notably, some industry observers said mobile HBM development and commercialization could progress more slowly than initially expected, as demand for HBM in servers, data centers, and AI accelerators is expected to remain strong for the foreseeable future. The report adds that booming demand for server and data center HBM may make it difficult for Samsung to fully concentrate its resources on mobile HBM development.　　SK hynix Advances Mobile AI Packaging　　SK hynix is also accelerating development of semiconductor packaging technologies for smartphones and Extended Reality (XR) devices. According to a Hankyung report published earlier this year, sources say the company is developing “High Bandwidth Storage (HBS),” a packaging solution that vertically stacks low-power (LPDDR) DRAM and NAND flash memory beside the Application Processor (AP), which handles core computing tasks in IT devices.　　Hankyung notes that HBS adopts a packaging technology called “Vertical Fan-Out” (VFO). Unlike conventional wire bonding, which connects stacked memory and substrates with thin copper wires, VFO uses pillar-shaped interconnects to enable denser wiring and faster data transfer speeds, helping APs process rapidly growing AI-driven workloads.

Key word：

Samsung

Release time：2026-05-15 10:49 reading：512 Continue reading>>

<span style='color:red'>AR</span>M CEO Says Agentic AI May Drive CPU Core Counts to 512 as GPU-CPU Ratios Become Less Relevant

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ARM CEO Says Agentic AI May Drive CPU Core Counts to 512 as GPU-CPU Ratios Become Less Relevant

　　The rise of agentic AI is fueling fresh debate over the future GPU-to-CPU balance in AI systems, with Arm CEO Rene Haas now weighing in on the discussion. According to a transcript published by Investing.com, Haas said that while CPUs may not outnumber GPUs on a chip basis, they could from a core-count perspective.　　Haas noted that overall CPU demand is likely to increase significantly as agentic AI scales, with data centers potentially requiring more than four times today’s CPU capacity. He said this could create a data center CPU market opportunity exceeding US$100 billion by 2030.　　At the same time, Haas emphasized that the industry is seeing not only an explosion in overall CPU demand, but also rapid growth in the number of cores per CPU. According to Haas, many agentic AI workloads involve independent jobs, flows, or batches running on dedicated CPU cores, increasing the need for higher-core-count processors.　　Haas used Blackwell, Rubin, and other large AI accelerators as examples, noting that these chips are already approaching reticle limits, meaning their size is constrained by the maximum area a lithography mask can print. In contrast, he said CPU core counts could still double or even quadruple over the coming years.　　Haas noted that the Arm AGI CPU already features 136 cores, significantly higher than many competing offerings. Looking ahead, he said the industry is likely to move toward 256-core and even 512-core CPU designs. He added that such high-core-count architectures play to Arm’s strengths, as efficiency per core becomes increasingly critical at larger scales.　　Mydrivers notes that AMD and Intel are moving in a similar direction. AMD’s 2nm Zen 6-based EPYC processors are already expected to reach up to 256 cores with SMT multithreading support, while Intel’s all-E-core Xeon processors have reached 288 cores, with the next generation expected to scale to as many as 512 cores.　　Regarding the Arm AGI CPU launched at the company’s Arm Everywhere event last quarter, Haas said customer response has been “very strong.” He added that customer demand across fiscal 2027 and fiscal 2028 has already exceeded US$2 billion, more than double the level projected at launch.

Key word：

ARM

Release time：2026-05-11 13:48 reading：437 Continue reading>>

Trade news

ROHM Launches an Ultra-Compact Wireless Power Chipset for Wearables

　　ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 - and transmitter - ML7671 - compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands as well as peripheral devices like smart pens.　　The smart ring market has seen rapid growth in recent years, primarily in healthcare and fitness applications. However, for extremely small ring-shaped devices worn on the finger, wired charging is impractical, while conventional Qi wireless charging standard is difficult to implement due to constraints such as coil size. This has driven increased demand for a proximity-based power transfer method capable of reliably charging ultra-compact devices.　　In response, NFC-based charging, which operates at the high-frequency 13.56MHz band that enables antenna miniaturization, is attracting increased attention, with adoption accelerating in next-generation wearables. Following the successful commercialization of the 1W ML7660/ML7661, ROHM has developed the ML7670/ML7671 chipset optimized for even smaller devices.　　This new chipset builds on the proven receiver - ML7660 - and transmitter - ML7661. The maximum power transfer is specified at 250mW, while peripheral components such as the switching MOSFETs required to supply power to the charging IC are built in. The result is a solution optimized for both mounting area and power transfer efficiency in the power class demanded by compact wearable devices, especially smart rings.　　The ML7670 power receiver IC achieves a maximum power transfer efficiency of 45% in the 250mW low output range – all in an industry-leading form factor of just 2.28 × 2.56 × 0.48mm. A key feature of the new chipset is superior performance that surpasses the efficiency of comparable products in the same class by optimizing elements such as coil matching, rectifier circuitry, and reduced losses in switching devices.　　What's more, all firmware required for wireless power delivery is embedded directly within the IC, eliminating the need for a host MCU. This significantly reduces board space along with development workload in device design.　　Compliance with NFC Forum (WLC 2.0) enables power transfer while maintaining compatibility with existing devices, positioning the chipset as a core element in the expanding NFC wireless power ecosystem.　　The new chipset is already in mass production. Furthermore, it has been adopted in SOXAI RING 2, the latest model launched on December 10th, 2025, by SOXAI, Inc. (“SOXAI” is pronounced “SOK-sai”.), the Japanese developer and distributor of the original sleep monitoring ring SOXAI RING. Evaluation boards and reference designs are also offered to facilitate integration. For more information, please contact a sales representative or submit an inquiry via the contact page on ROHM’s website.　　Going forward, ROHM will continue to promote device development that leverages miniaturization and low-power consumption technologies essential for wearable devices, contributing to improved user convenience and the continued growth of the wearable market.　　Specifications　　Case Study: SOXAI RING 2 Adoption Example SOXAI RING is the only smart ring for sleep management developed in Japan capable of accurately capturing and analyzing sleep data. It incorporates cutting-edge technologies such as an optical vital sensor, temperature sensor, accelerometer, Bluetooth® Low Energy communication, and NFC wireless charging functionality.　　The latest model, SOXAI RING 2, is equipped with Deep Sensing™, a proprietary photoplethysmography (PPG) sensor that significantly improves measurement accuracy, enabling the visualization of physical health changes with far greater depth and precision.　　Bluetooth® is a registered trademark of Bluetooth SIG, Inc. in the US.　　Deep Sensing™ is a trademark or registered trademark of SOXAI, Inc.

Key word：

ROHM

Release time：2026-04-29 10:03 reading：435 Continue reading>>

MicroLED Gains Focus as Seoul Semiconductor Plans $180M <span style='color:red'>AR</span> Investment, Aledia Reports Breakthrough

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MicroLED Gains Focus as Seoul Semiconductor Plans $180M AR Investment, Aledia Reports Breakthrough

　　Amid mounting margin pressure and slowing growth in the LED industry, players are moving beyond traditional segments in search of new momentum, with MicroLED emerging as a key focus. According to MicroLED-info, Seoul Semiconductor plans to invest KRW 250 billion (around $180 million) over the next five years, primarily in the R&D and production of microLED microdisplay modules for AR applications.　　The report suggests that the company has embarked on a government-approved restructuring plan as its core LED package business faces mounting pressure from falling prices and weakening profitability. Under the initiative, the new displays will be built on Seoul Semiconductor’s proprietary WICOP (Wafer Integrated Chip on PCB) technology, the report adds.　　As noted by Maeil Ilbo, founded in 1992, Seoul Semiconductor supplies LED packages across lighting, automotive, and IT, and holds about a 4.8% global share in the optoelectronics market. Despite its proprietary wire-free WICOP technology, the company has come under pressure from persistent price declines and softer demand, weighing on margins, the report explains.　　French MicroLED Startup Achieves Key Milestone　　On the other hand, French startup Aledia, according to MicroLED-info, has successfully demonstrated a fully functional monolithic RGB epitaxial wafer, marking a key milestone for the technology. The achievement validates the company’s end-to-end monolithic RGB process, enabling red, green, and blue emission from a single epi wafer fabricated in a single run, the report notes.　　According to the company, its proprietary nanowire-based architecture can grow nanowires in a single processing step, with diameters ranging from 100 nm to 400 nm depending on the target wavelength, enabling full RGB capability within one unified structure.　　On device performance, the company demonstrated a 2.5 μm sub-pixel pitch—equivalent to a 5.0 μm × 5.0 μm pixel size—and outlined a roadmap to further shrink this to 2.0 μm for both monochrome and monolithic RGB displays, MicroLED-info suggests.　　In parallel, Aledia has validated its 9V microLED devices on 200 mm silicon wafers, including 15×30 μm blue emitters on the same platform. The company also confirmed the commercial availability of its 3D-Nano microLED technology built on 200 mm silicon in February, the report adds.

Key word：

Optical Semiconductors

Release time：2026-04-27 10:39 reading：513 Continue reading>>

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BIWIN Mini SSD Wins “Memory of the Year” of 2026 China IC Design Awards

　　Recently, the 2026 International IC & Component Exhibition and Conference (shortened as IIC), hosted by Aspencore, successfully concluded in Shanghai. At the concurrent 2026 China IC Design Awards Ceremony, BIWIN Mini SSD was honored with the “Memory of the Year” award. This recognition not only affirms the product’s technological innovation and commercial value, but also highlights BIWIN’s continued leadership and long-term commitment to advancing the memory industry.　　01 Redefining SSD Form Factor and Architecture　　“China IC Design Awards”, as one of the most authoritative and creditable industry awards, acknowledges enterprises and products that stands out in technological innovation, market application, and industry contribution. Among these, “Memory of the Year” Award, as one of the core evaluative unit, cites memory products that features innovative design, scaled production, and technical improvements.　　Rather than merely a physically-miniaturized SSD, BIWIN Mini SSD breaks the traditional trade-off between performance, size, and scalability. Through innovating solutions and advanced packaging, Mini SSD offers a brand-new memory solution combined with compact form factor, strong performance and excellent scalability for AI PC and on-device AI scenarios. It effectively addresses key limitations of existing solutions, such as the oversized form factor of M.2 SSD, performance bottlenecks of MicroSD cards, and limited scalability of UFS/eMMC.　　Ultra-compact, flagship performance　　Delivers up to 2TB capacity, 3700MB/s read, and 3400MB/s write speeds in just 40% the size of an M.2 2230 SSD and about 1g weight.　　Rugged and reliable　　Engineered with IP68-rated dust and water resistance, 3-meter drop protection, and 12,000+ insertion cycles for demanding mobile environments.　　Tool-free expandability　　Features an industry-first standardized slot-based design, enabling seamless TB-level storage upgrades without tools.　　Since its debut, BIWIN Mini SSD has received widespread global recognition, including Best Inventions of 2025 by TIME, CES 2026 TWICE Picks Award, Embedded World Best-in-Show, and MWC 2026 Best-in-Show. It has also been shortlisted for the 2026 Edison Awards, often referred to as the “Oscars of innovation.” This latest recognition further validates Mini SSD’s leadership across both technology innovation and commercial potential.　　02 Accelerating Ecosystem and Standardization　　BIWIN Mini SSD is more than a product—it is the foundation of an open ecosystem. It has already been adopted by leading brands such as One-Netbook, GPD, and Waterworld, enabling commercialization in AI PCs and handheld gaming devices. To accelerate adoption, BIWIN is collaborating with ecosystem leaders including Intel, Longcheer, BYD Electronics and Luxshare Precision.　　Promoting Standardization to Reduce Compatibility Costs　　Establishing IP enterprises, incentive mechanisms and royalty-sharing frameworks to to align ecosystem interests; opening up technical specifications and interface standards to lower integration barriers and reduce industry-wide adaptation costs.　　Accelerating Adoption Across AI Devices　　Focusing on key scenarios such as AI PC, intelligent robots, and gaming consoles, with multiple partners actively working on integration; collaborating with partners to speed up technical validation, introduction and industry-wide application.　　Advancing the Technology Roadmap　　Deploying forward-looking products such as PCIe Gen4 ×4 and Gen5 ×4 solutions to enhance bandwidth performance; advancing R&D on 4TB or larger-capacity products based on 32-die stacking packaging process.　　03 Full-Stack Capabilities Power “Device–Edge–Cloud”　　The success of BIWIN Mini SSD is rooted in BIWIN’s full-stack capabilities based on “Integrated Solutions and Manufacturing” strategy. With continuous investments in R&D to reinforce the innovation foundation, BIWIN has spent RMB 632 million in 2025, representing a 41.34% year-on-year growth. To date, BIWIN has accumulated 521 patents worldwide along with 66 software copyrights.　　Backed by deep expertise across solution development, IC design, and advanced packaging technologies, BIWIN has built a comprehensive portfolio covering edge AI devices, smart terminals, industrial and automotive-grade applications, as well as enterprise storage. This end-to-end capability enables the company to effectively serve customers across the device–edge–cloud spectrum, translating technology into real-world competitiveness.　　In emerging on-device AI, BIWIN’s ePoP solutions combine ultra-thin stacking with power-efficient firmware, supporting leading companies such as Google, Meta, Xiaomi, and Rokid. These solutions are optimized for wearables like smart glasses and smartwatches, where size, latency, and power efficiency are critical. In automotive, BIWIN has been adopted by 20+ OEMs and Tier 1 suppliers, with products already in mass production. In the cloud segment, its enterprise SSDs are shipping at scale to leading OEMs, AI server vendors, and major internet companies.　　The “Memory of the Year” award at the 2026 China IC Design Awards underscores the technical strength and commercial momentum of BIWIN Mini SSD. BIWIN will continue to focus on innovation to meet the growing demands of the AI era and drive long-term growth.

Key word：

BIWIN

Release time：2026-04-24 10:27 reading：535 Continue reading>>

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Renesas’ Radiation Hardened ICs Take Flight on NASA’s Artemis II Crewed Lunar Mission

　　TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its radiation‑hardened (rad-hard) ICs are being used in NASA’s Artemis II mission, which successfully launched from the Kennedy Space Center in Florida on April 1. The first crewed mission around the moon in decades, Artemis II represents a major milestone in NASA’s plans to return humans to the moon and establish a long-term presence on the lunar surface.　　Four astronauts are now en route to orbit the moon aboard NASA’s Orion spacecraft as part of NASA’s Artemis II mission, taking humans farther from Earth than they have traveled in over fifty years. During the flight, the crew will test spacecraft systems and crew performance in this deep‑space environment before returning safely home. The mission will validate key spacecraft capabilities and position Orion for future crewed journeys and lunar landings.　　Within the Artemis II core systems, including the Orion capsule and Space Launch System (SLS) rocket, Renesas rad-hard ICs are used across multiple subsystems. These Intersil-branded devices are embedded in the space vehicle’s avionics and safety launch system, helping to regulate and distribute power, maintain signal integrity and support onboard computing. These specialized ICs are built to operate reliably when exposed to the elevated levels of radiation and extreme temperatures that are typical of human space missions.　　“Human space flight missions leave no margin for failure, and we’re proud to be one of the select few semiconductor companies entrusted to provide space-qualified technology for this historic crewed Artemis mission,” said Chris Stephens, Vice President of the HiRel Business Division at Renesas. “Our rad-hard devices help keep spacecraft systems connected, protected and precisely controlled, as crews venture into deep space. We look forward to supporting future landmark missions and ushering in the next era of solar system exploration with our space‑grade semiconductor solutions.”　　The Renesas Intersil brand has a long history in the space industry spanning more than six decades, beginning with the founding of Radiation Inc. in 1950. Since then, virtually every satellite, shuttle launch and deep-space exploration mission has included Intersil-branded products. Renesas leverages this experience to deliver efficient, thermally-optimized and highly-reliable SMD, MIL-STD-883 and MIL-PRF 38535 Class-V/Q Intersil-branded products for the defense, high-reliability (Hi-Rel), and rad-hard space markets. Renesas Intersil-brand rad-hard ICs support subsystems for mission critical applications in data communications transfer, power supplies and power conditioning, general protection circuitry, and telemetry, tracking and control (TT&C).　　For more information on Renesas’ Intersil-brand space and hi-reliability solutions, visit: www.renesas.com/space.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.　　The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.

Key word：

Renesas

Release time：2026-04-08 17:16 reading：698 Continue reading>>

Trade news

MWC 2026 | Fibocom Unveils AI ECR Solution, Ushering in a New Era of Smart Retail

　　At MWC 2026, Fibocom introduced its next-generation AI Electronic Cash Register (ECR) solution for automated and smart retail scenarios.　　Powered by MediaTek’s high-performance Genio 520/720 IoT platform, the solution offers exceptional scalability and supports on-device large model integration, enabling global retailers to deliver smarter, faster, and more immersive retail experiences.　　Core Hardware Power: High-Performance Edge AI Computing　　Built on an advanced 6nm octa-core processor, the AI ECR provides strong edge AI computing for both traditional and intelligent retail operations.　　Equipped with 2× Cortex-A78 (@2.2GHz) and 6× Cortex-A55 (@2.0GHz) cores plus an NPU 850 delivering up to 10 TOPS, it supports local large language models for voice interaction, inventory forecasting, and visual recognition — minimizing cloud reliance while ensuring faster response and data privacy.　　Immersive Visual & Seamless Connectivity　　The platform supports a 15.6-inch 2K display with 2D/3D acceleration and can drive 4K/5K ultra-HD screens, ideal for digital signage.　　To meet diverse retail needs, it integrates dual-camera input (MIPI CSI + USB) for facial payment and behavior analysis, plus multiple I/O ports (USB-A/C, HDMI, RJ45, RJ12, audio) for peripherals.　　Built-in Wi-Fi 6 (1×1) and Bluetooth 5.3 ensure high-speed, stable wireless connections.　　Powered by Android 15: Secure and Future-Ready　　Among the first to run Android 15, the solution provides an open, secure ecosystem with enhanced multitasking, memory management, and system-level protection—ensuring smooth, long-term performance for industrial and consumer-grade applications.　　“We look forward to continuing our collaboration with Fibocom, leveraging the MediaTek Genio platform to deliver powerful edge AI performance with on-device large model support,” said CK Wang, Vice President and General Manager of MediaTek IoT. “This solution demonstrates our shared commitment to advancing smart retail and helping businesses become more competitive and efficient.”　　Ralph Zhao, General Manager of Mobile Computing Solutions BU at Fibocom, stated:　　“As the retail industry accelerates toward automation and intelligence, edge AI computing has become the key to improving user experience. Fibocom’s new AI ECR solution represents a breakthrough in hardware design and enables large-model applications at the point of sale with 10 TOPS of processing power — empowering partners to build more competitive and intelligent retail solutions.”

Key word：

Fibocom

Release time：2026-03-10 16:24 reading：791 Continue reading>>

model	brand	Quote
RB751G-40T2R	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor
MC33074DR2G	onsemi
CDZVT2R20B	ROHM Semiconductor
TL431ACLPR	Texas Instruments

model	brand	To snap up
BP3621	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
STM32F429IGT6	STMicroelectronics
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BU33JA2MNVX-CTL	ROHM Semiconductor

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